Topic
Advanced semiconductor packaging
Techniques such as 3D stacking, chiplet integration, backside power delivery, and co-packaged optics used to extend chip performance beyond planar transistor scaling.
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Background
Selected excerpts from Wikipedia. This is general background, not Angle's reporting, and it may have changed since the stories above were published.
Advanced packaging is the aggregation and interconnection of components before traditional integrated circuit packaging, where a single die is packaged. Advanced packaging allows multiple devices, including electrical, mechanical, or semiconductor devices, to be merged and packaged as a single electronic device. Advanced packaging uses processes and techniques that are typically performed at semiconductor fabrication facilities, unlike traditional integrated circuit packaging, which does not. Advanced packaging thus sits between fabrication and traditional packaging-or, in other terminology, between BEoL and post-fab. Advanced packaging includes multi-chip modules, 3D ICs, 2.5D ICs, heterogeneous integration, fan-out wafer-level packaging, system-in-package, quilt packaging, combining logic (processors) and memory in a single package, die stacking, wafer bonding/stacking, several chiplets or dies in a package, combinations of these techniques, and others. 2.5D and 3D ICs are also called 2.5D or 3D packages.
Advanced packaging can help achieve performance gains through the integration of several devices in one package and associated efficiency gains (by reducing the distances signals have to travel; in other words, reducing signal paths), and allowing for a high number of connections between devices, without relying on smaller transistors, which have become increasingly more difficult to manufacture. This mitigates the rising costs and yield degradation associated with monolithic (advanced) nodes by enabling heterogeneous integration, where mature nodes are used for analog/IO and advanced nodes are reserved for the core logic. Fan-out packaging is seen as a low-cost option for advanced packaging.
Advanced packaging is considered fundamental in expanding Moore’s Law. …
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